1,Manufacturing specification
Items
Technology & Capability
Mass Production
Prototypes
Max. Layer Count
8 Layers
14 Layers
Max. Panel Size
600 *770mm
600*770mm , 500*1200mm
Max. Board Thickness
8.5mm
8.5mm
Min Inner Layer Clearance
7 mils
5 mils
Pattern Density -
Outer Layer -
Inner Layer

4/4 mils
4/4 mils

4/4 mils
4/4 mils
Min. Board Thickness
2L: 0.3mm
4L: 0.4mm
6L: 0.8mm
2L: 0.3mm
4L: 0.4mm
6L: 0.6mm
Min SMT/BGA Pitch
12 mils for SMT
24mils for BGA
12 mils for SMT
20mils for BGA
Min. Drill Size
& Aspect Ratio
0.2mm Drill for 0.8mm
thickness (4.0:1)
0.25mm Drill for1.6mm
thickness (6.4:1)
0.30mm Drill for 2.4mm
thickness (8.0:1)
0.2mm Drill for 0.8mm
thickness (4.0:1)
0.20mm Drill for1.6mm
thickness (8.0:1)
0.25mm Drill for 2.4mm thickness (9.6:1)
Surface Finishes
HASL, OSP
Immersion and Electrolytic Gold,
HASL, OSP
Immersion and Electrolytic Gold,
Controlled Impedance
+/- 10%
+/- 7%
Contouring
Routing, V-Groove, Beveling punch
Routing, V-Groove, Beveling punch
Hole Diameter
+/-2 mil.
+/-2 mil.
Min S/M Thickness
0.4mil
0.6mil
Heavy Copper
4OZ/140μm
5OZ/175μm
Production capacity
layers
PCB Prototypes Capacity
PCB Mass Production
Remarks
1
200 types per month
5000 ft2 per month
Reall output
2
800 types per month
10000 ft2 per month
Reall output
4
500 types per month
5000 ft2 per month
Reall output
6
300 types per month
4000 ft2 per month
Reall output
8
200 types per month
3000 ft2 per month
Reall output

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