1,Manufacturing specification
Preferred Materials
FR4 Standard Tg Shengyi, ITEQ, KB, Nanya

FR4 Mid Tg (Lead Free


Shengyi S1000, ITEQ IT158

FR4 High Tg

(Lead Free Compatible)

Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR ITEQ IT180A Panasonic R1755V

High Performance

Low Loss FR4

EMC EM828, EM888(S), EM888(K) Isola FR408, FR408HR Isola I‐Speed, I‐Tera MT Nelco N4000‐13EP, EPSI Panasonic R5775 Megtron 6
RF Materials Rogers RO4350, RO3010 Taconic RF‐30, RF‐35, TLC, TLX, TLY Taconic 601, 602, 603, 605
Halogen Free EMC EM285, EM370(D) Panasonic R1566
Aluminum Backed PCB Shengyi SAR20, Yugu YGA
Standard Features Standard Advanced
Maximum Layer Count 20 36
Maximum Panel Size  533x610mm [21x24"] 610x1067mm [24x42"]

Outer Layer Trace/Spacing

(1/3oz starting foil + platig)

90µm/90µm [0.0035"/0.0035"] 64µm/76µm

Inner Layer Trace/Spacing

 (Hoz inner layer cu)   

76µm/76µm [0.003"/0.003"] 50µm/50µm [0.002"/0.002"]
Maximum PCB Thickness 3.2mm [0.125"] 6.5mm [0.256"]
Minimum PCB Thickness .20mm [0.008"] .10mm [0.004"]
Minimum Mechancial Drill Size .20mm [0.008"] .10mm [0.004"]
Minimum Laser Drill Size .10mm [0.004"] .08mm [0.003"]
Maximum PCB Aspect Ratio 10:1 25:1
Maximum Copper Weight 5 oz [178µm] 6 oz [214µm]
Minimum Copper Weight 1/3 oz [12µm] 1/4 oz [9µm]
Minimum Core Thickness 50µm [0.002"] 38µm [0.0015"]
Minimum Dielectric Thickness 64µm [0.0025"] 38µm [0.0015"]
Minimum Pad Size Over Drill  0.46mm [0.018"] 0.4mm [0.016"]
Solder Mask Registration ± 50µm [0.002"] ± 38µm [0.0015"]
Minimum Solder Mask Dam 76µm [0.003"] 64µm [0.0025"]
Copper Feature to Edge, V‐cut (30°) 0.40mm [0.016"] 0.36mm [0.014"]
Copper Feature to PCB Edge, Routed 0.25mm [0.010"] 0.20mm [0.008"]

Tolerance on Overall 


± 100µm [0.004"] ±50µm [0.002"]
Additional Materials
 Rigid Polyimide:  Shengyi SH260, Ventec VT901
 BT Epoxy:  Nelco and Mitsubishi
 High CTI FR4:  Shengyi S1600
 Flexible Circuit Materials:  Dupont, Panasonic, Taiflex, Shengyi 
Surface Finishes
Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM
HDI Features  Standard Advanced
Minimum Microvia Hole Size  100µm [0.004"] 75µm [0.003"]
Capture Pad Size 0.25mm [0.010"] 0.20mm [0.008"]
Glass Reinforced Dielectrics Y Y
Maximum Aspect Ratio 0.7:1 1:1
Stacked Microvias Y Y
Copper Filled Microvias Y Y
Buried Filled Vias Y Y
Maximum No. of Buildup Layers 3+N+3 5+N+5
PCB Technologies Standard Advanced
Rigid‐Flex & Flexible Circuits Y Y
Buried and Blind Vias Y Y
Sequential Lamination Y Y
Impedance Control  ± 10% ± 5%
Hybrids & Mixed Dielectrics  Y Y
Aluminum PCB's  Y Y
Non‐Conductive Via Fill (VIP)  Y Y
Conductive Via Fill  Y Y
Cavity Boards  Y Y
Backdrilling Y Y
Controlled Depth Drill and Rout Y Y
Edge Plating  Y Y
Buried Capacitance Y Y
Etch Back Y Y
In‐board Beveling Y Y
2‐D Bar Code Printing Y Y
Advanced Processes
Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Plating for High Layer Count and Microvias Products
Reverse Pulse Plating
Solid Copper Plated PTH Vias
XACT Tooling System for Improved Layer‐to‐Layer Registration
Spray Coating for Soldermask
Inkjet Printing for Legend
In‐Line AOI for Outerlayers and AOI for Final Inspection
ORMET® Copper Paste for Any‐layer Connections
ZETA® Material for HDI and Low‐Loss Applications
Quality System and Certifications

IPC Specs: IPC‐A‐600, IPC‐6012, IPC‐6013, IPC‐6016 (Class II and 

Class III)

Quality System Certifications:  ISO 9001:2008, TS16949:2009, ISO13485:


Environmental Certifications: ISO14001:2004, ISO/TS14067:2013
UL Certification:  File number E332056

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